1. general description the 74vhc126-q100; 74vhct126-q100 are high -speed si-gate cmos devices and are pin compatible with low-power schottky ttl (lsttl). they are specified in compliance with jedec standard no. 7-a. the 74vhc126-q100; 74vhct126-q100 provide four non-inverting buffer/line drivers with 3-state outputs. the output enable input (noe) controls the 3-state outputs (ny). a low-level at pin noe causes the outputs to assume a high-impedance off-state. this product has been qualified to the automotive electronics council (aec) standard q100 (grade 1) and is suitable for use in automotive applications. 2. features and benefits ? automotive product qualif ication in accordance with aec-q100 (grade 1) ? specified from ? 40 ? c to +85 ? c and from ? 40 ? c to +125 ? c ? balanced propagation delays ? all inputs have schmitt-trigger action ? inputs accept voltages higher than v cc ? input levels: ? the 74vhc126-q100 operates with cmos input level ? the 74vhct126-q100 operates with ttl input level ? esd protection: ? mil-std-883, method 3015 exceeds 2000 v ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115-a exceeds 200 v (c = 200 pf, r = 0 ? ) ? multiple package options 74vhc126-q100; 74vhct126-q100 quad buffer/line driver; 3-state rev. 1 ? 15 november 2013 product data sheet
74vhc_vhct126_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserve d. product data sheet rev. 1 ? 15 november 2013 2 of 16 nxp semiconductors 74vhc126-q100; 74vhct126-q100 quad buffer/line driver; 3-state 3. ordering information 4. functional diagram table 1. ordering information type number package temperature range name description version 74vhc126d-q100 ? 40 ? cto+125 ? c so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 74vhct126d-q100 74VHC126PW-Q100 ? 40 ? cto+125 ? c tssop14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 74vhct126pw-q100 74vhc126bq-q100 ? 40 ? cto+125 ? c dhvqfn14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 ? 3 ? 0.85 mm sot762-1 74vhct126bq-q100 fig 1. functional diagram mna235 1a 1y 2 1 3 1oe 2a 2y 5 4 6 2oe 3a 3y 9 10 8 3oe 4a 4y 12 13 11 4oe fig 2. logic symbol fig 3. iec logic symbol mna234 noe na ny mna236 1 en1 1 3 2 4 6 5 10 8 9 13 11 12
74vhc_vhct126_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserve d. product data sheet rev. 1 ? 15 november 2013 3 of 16 nxp semiconductors 74vhc126-q100; 74vhct126-q100 quad buffer/line driver; 3-state 5. pinning information 5.1 pinning 5.2 pin description (1) this is not a supply pin. the substrate is attached to this pad using conductive die attach material. there is no electrical or mechani cal requirement to solder this pad. however, if it is soldered, the solder land should remain floating or be connected to gnd. fig 4. pin configuration so14 and tssop14 fig 5. pin configuration dhvqfn14 9 + & |